What is Thermal Design And How does it Work?

What is Thermal Design?

Thermal design is to release heat from the electronic components to resolve the power loss and transfer heat under operating conditions.

Thermal design refers to incorporating the necessary thermal management through thermal simulations.

The thermal design includes evaluating key factors such as the amount of space available for thermal design, the thermal design power, the temperature of the chip case, the ambient temperature, and the thermal resistance.

WHY do you need our thermal design?

5G/WiFI-6E communication need faster and bigger data transmission, which release higher heat from the electronic components. This is especially crucial for the heat dissipation in electrical enclosures or fan-less system, such as, a IP67 Wifi router, an edge computing equipment, C-V2X application, CPE, RRU, small cell etc.

To maintain the products’ life and performances, the system needs to cool down with thermal solutions.

As the terminal devices design become more compact and consume more power, thermal solutions will be developed in response to these intensified thermal demands.

Thermal Solution - Grand-Tek

The Tasks of Thermals

Heat Insulation Design: Design for decreasing the heat transfer to enhance the insulation purpose.
Enhance Heat Transfer and Temperature Control : Design for improving heat transfer to decrease component and housing temperature to meet thermal specification.

HOW a thermal solution works?

A first solution is to use conduction, meaning transferring the heat to another place. The thermal conductivity of different materials will affect the thermal efficiency. Ex of conductive components used: Heat Pipe/ Vapor Chamber / thermofin

The type of the thermal designs, hotspot, heat pipe, fan. - Grand-Tek

Key Words for Thermal Design

The thermal design in the device mainly evaluates the following key words:

Keep Out Zone: How much space is left for thermal design? For example, the device needs to install a heat sink, the space will determine the size of the heat sink, or the heat dissipation efficiency
Thermal Design Power: The heat source in the device, for example, how high is the power when the chip is operating?
Temperature of Chip case: How high will the case temperature rise when the chip is in operation?
Ambient temperature: What is the ambient temperature range where the device is located?
Thermal resistance = (Tc-Ta)/TDP: Ease of heat transfer. A high thermal resistance value means that heat is difficult to transfer, while a low thermal resistance value means that heat is easy to transfer.
Active or fanless solution: Evaluate whether the convection effect of the device is good enough and determine whether it is necessary to increase the wind dispersion.
Gravity direction: The direction of action of the heat sink will be affected by gravity, so it must be understood whether the installation direction of the device is vertical or horizontal.

The type of the thermal designs, hotspot, heat pipe, fan. - Grand-Tek

Our complete Thermal Solution package-Thermal Design Process

They are several ways of solving thermal issues in an enclosed electronical system. We have a dedicated thermal team who collaborates with Mechanical Engineers, Electronic Engineers, and Radio Frequency Engineers. We listen to your needs and analyze your system and the material of the components to then advise you with an efficient solution.
Our goal is NOT to sell you a thermal component but to provide you with the best integrated thermal solution for your device to optimize its performance.

The type of the thermal designs, hotspot, heat pipe, fan. - Grand-Tek
RFQ stage
EVT/DVT stage
PVT Stage
MP Stage
Work list :
Identify thermal specifications of system
Thermal Conditions Identification
ROI Evaluation
Work list :
Design-Profit Model Design
Sample Engineering TCO
Design Optimization
Sample run
Work list :
Yield rate analysis
Mass production feasibility
Pilot run
Work list :
Material Sustainability Study
Documents Approval
SOP setup
QC flow setup

The CASE of thermal design- 5G Wireless Thermal Solution

Before thermal design, first step is necessary to know how many heat sources are in the device. We will conduct thermal tests for multi or single-heat sources. In order to understand the Key Words for Thermal Design in the unit.

The type of the thermal designs, hotspot, heat pipe, fan. - Grand-Tek

If the chips layout and the heats are too concentrated. We can embed the heat pipes / VC into the enclosure to increase heat spreading efficiency.

The type of the thermal designs, hotspot, heat pipe, fan. - Grand-Tek